Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Cosmic Plastics, Inc. |
Trademark: | FARBOSET® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | 63E8aB_FARBOSET-1190.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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Cosmic FARBOSET 1190 Black is a fast curing, mineral & glass filled, epoxy molding compound with improved strength properties. It is designed for the encapsulation of coils, transformers, switches and other electrical and electronic components requiring excellent thermal shock resistance. This material exhibits superior resistance to cracking. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Appearance |
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Forms |
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Processing Method |
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Physical | Nominal Value | Unit | |
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Density 1 | 1.91 | g/cm³ | |
Apparent Density 2 | 1.00 | g/cm³ | |
Spiral Flow | 69.0 | cm | |
Molding Shrinkage - Flow | 0.50 | % |
Hardness | Nominal Value | Unit | |
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Durometer Hardness (Shore D) | 85 |
Mechanical | Nominal Value | Unit | |
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Tensile Strength | 96.5 | MPa | |
Flexural Strength | 138 | MPa | |
Compressive Strength | 241 | MPa |
Impact | Nominal Value | Unit | |
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Notched Izod Impact | 32 | J/m |
Thermal | Nominal Value | Unit | |
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Deflection Temperature Under Load (1.8 MPa, Unannealed) | 110 | °C | |
Thermal Conductivity | 0.84 | W/m/K | |
Maximum Operating Temperature - Intermittent | 200 | °C |
Additional Information | Nominal Value | Unit | |
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Loss Factor - 1 kHz | 0.0150 |
Electrical | Nominal Value | Unit | |
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Surface Resistivity | 1.0E+16 | ohms | |
Volume Resistivity | 1.0E+16 | ohms·cm | |
Dielectric Strength 3(3.18 mm) | 14 | kV/mm | |
Dielectric Constant (1 kHz) | 3.80 | ||
Dissipation Factor (1 kHz) | 4.0E-3 | ||
Arc Resistance | 200 | sec |
Thermoset | Nominal Value | Unit | |
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Shelf Life 4 | |||
5°C | 52 | wk | |
25°C | 1.0 | wk | |
35°C | 0.29 | wk |
Uncured Properties | Nominal Value | Unit | |
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Curing Time | |||
150°C 5 | 0.012 | hr | |
150°C | 0.025 to 0.050 | hr |
Injection | Nominal Value | Unit | |
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Processing (Melt) Temp | 150 to 180 | °C | |
Injection Pressure | 0.345 to 6.89 | MPa |
Note Message | |
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1 . | Molded |
2 . | Powder |
3 . | Method A (Short-Time) |
4 . | Defined as not more than 40% loss of spiral flow based on original values. |
5 . | Hot Plate Cure Time |
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