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EPO-TEK® H67-MP
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 5y4ABm_EPO-TEK-H67-MP.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H67MP is a single component, thermally conductive epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | < 200 | ppm | |
| K+ | < 50 | ppm | |
| Na+ | < 50 | ppm | |
| NH4+ | 87 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 350 | °C | TGA |
| Die Shear Strength - >20 kg (23°C) | 46.9 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 4.43 | GPa | |
| Weight Loss on Heating | |||
| 200°C | 0.48 | % | |
| 250°C | 0.71 | % | |
| 300°C | 1.2 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 90.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 1.6E-5 | cm/cm/°C | |
| -- 3 | 6.8E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.45 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | White | ||
| Density | 2.00 | g/cm³ | |
| Viscosity 4(23°C) | 300 to 400 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 84 | ||
| Lap Shear Strength (23°C) | 10.5 | MPa | |
| Relative Permittivity (1 kHz) | 4.90 | ||
| Volume Resistivity (23°C) | > 6.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 4.1E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -40-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 1 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP PP 30 GF FR0 BLK | RTP Company | PP, Unspecified | RTP |
| Sumitomo Phenolic FM 1132P | Sumitomo Bakelite North America, Inc. | Phenolic | Sumitomo Phenolic |
| CALP MRP421 | Lion Idemitsu Composites Co., Ltd. | Polyolefin, Unspecified | CALP |
| PERCOM® FAH16FR | A. Schulman Europe | PP, Unspecified | PERCOM® |
| PLUSTEK RA304G6 | Polyram Ram-On Industries | Nylon 66 | PLUSTEK |
