Category: | TP, Unspecified , Crosslinkable Semiconductive Shielding Compound |
Manufacturer: | The Dow Chemical Company |
Trademark: | Dow ENDURANCE™ |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | 59d3KB_Dow-ENDURANCE-HFDB-0586-BK.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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DOW ENDURANCE™ HFDB-0586 BK is a specially formulated semiconductive, vulcanizable compound designed for conductor shield and bonded insulation shield applications in medium and high voltage crosslinked polyethylene insulated cables.(1) DOW ENDURANCE™ HFDB-0586 BK has stable volume resistivity characteristics at elevated temperatures and is formulated with a polymer system that has demonstrated compatibility with copper and aluminum conductors. Specifications DOW ENDURANCE™ HFDB-0586 BK is designed for use in power distribution cables. Cables with conductor and insulation shielding of DOW ENDURANCE™ HFDB-0586 BK, prepared using sound commercial fabrication practice, would be expected to meet the following specifications:
(1) DOW ENDURANCE™ HFDB-0586 BK is recommended for use in conjunction with DOW cross-linked polyethylene and tree-retardant cross-linked polyethylene compounds. For other polymer insulation such as EPR and EPDM's, the user is cautioned to establish the utility of DOW ENDURANCE™ HFDB-0586 BK with each formulation. |
General Information | |
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Uses |
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Agency Ratings |
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Forms |
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Physical | Nominal Value | Unit | Test Method |
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Density | 1.10 | g/cm³ | ASTM D1505 |
Environmental Stress-Cracking Resistance (100% Igepal, F0) | > 504 | hr | ASTM D1693 |
Mechanical | Nominal Value | Unit | Test Method |
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Tensile Strength | 15.9 | MPa | ASTM D638 |
Tensile Elongation (Break) | 300 | % | ASTM D638 |
Aging | Nominal Value | Unit | Test Method |
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Tensile strength retention- 1 week (150°C) | 90 | % | ASTM D638 |
Elongation retention rate- 1 week (150°C) | 95 | % | ASTM D638 |
Thermal | Nominal Value | Unit | Test Method |
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Brittleness Temperature | -40.0 | °C | ASTM D746 |
Electrical | Nominal Value | Unit | Test Method |
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Volume Resistivity | ASTM D991 | ||
23°C | 6.0 | ohms·cm | ASTM D991 |
90°C | 20 | ohms·cm | ASTM D991 |
130°C | 15 | ohms·cm | ASTM D991 |
Additional Information |
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Nominal property values above represent tests on molded stress-relieved slabs. Cure times were 15 minutes at 175°C.Storage The environment or conditions of storage greatly influences the recommended storage time. Storage should be in accordance with good manufacturing practices. If proper warehousing and storage temperatures [dry conditions, between 50°F and 86°F (10°C and 30°C) in temperature] are utilized, this product may be stored by the customer for up to one year. It is recommended that the practice of using the product on a first-in / first-out basis be established. Storage under extreme conditions may affect the quality, processing, or performance of the product. |
Extrusion | Nominal Value | Unit | |
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Drying Temperature | 60.0 - 70.0 | °C | |
Drying Time | < 6.0 | hr | |
Melt Temperature | 121 - 140 | °C |
Extrusion instructions |
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DOW ENDURANCE™ HFDB-0586 BK provides excellent surface finish and outstanding output rates over a broad range of conditions. For optimum results, use melt extrusion temperatures in the suggested range of 250 to 285°F (121 to 140°C) to avoid pre-cure or scorch. Extruder barrel settings of 230°F (110°C) are suggested as a starting point while learning to process DOW ENDURANCE™ HFDB-0586 BK. Specific machine settings will depend on the extruder design and must be established through conventional practices. The curing temperature should be carefully controlled, and the maximum surface temperature in the CV tube should not exceed 572°F (300°C) for optimum results.Dehumidified air hopper drying at 140-160°F (60-70°C) for up to six hours may be employed to remove residual moisture prior to extrusion. Drying is not necessary for DOW ENDURANCE™ HFDB-0586 BK due to the lower moisture absorption characteristics relative to conventional semiconductive products. |
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