Dow ENDURANCE™ HFDB-0586 BK

Category: TP, Unspecified , Crosslinkable Semiconductive Shielding Compound
Manufacturer: The Dow Chemical Company
Trademark: Dow ENDURANCE™
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 59d3KB_Dow-ENDURANCE-HFDB-0586-BK.pdf
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Message
DOW ENDURANCE™ HFDB-0586 BK is a specially formulated semiconductive, vulcanizable compound designed for conductor shield and bonded insulation shield applications in medium and high voltage crosslinked polyethylene insulated cables.(1) DOW ENDURANCE™ HFDB-0586 BK has stable volume resistivity characteristics at elevated temperatures and is formulated with a polymer system that has demonstrated compatibility with copper and aluminum conductors.

Specifications
DOW ENDURANCE™ HFDB-0586 BK is designed for use in power distribution cables. Cables with conductor and insulation shielding of DOW ENDURANCE™ HFDB-0586 BK, prepared using sound commercial fabrication practice, would be expected to meet the following specifications:
  • AEIC: CS8, CS9
  • BS: 6622
  • CEA: WCWG-01, WCWG-02
  • CSA: C68.2, C68.3
  • DIN: VDE 0276, VDE 0263
  • Edf: HN-33-S-23, HN-33-S-52
  • ESI: 09-14
  • HD: 620 S1
  • ICEA: S-94-649, S-66-524 (NEMA WC7)
  • IEC: 60502, 60840
  • UL: 1072

(1) DOW ENDURANCE™ HFDB-0586 BK is recommended for use in conjunction with DOW cross-linked polyethylene and tree-retardant cross-linked polyethylene compounds. For other polymer insulation such as EPR and EPDM's, the user is cautioned to establish the utility of DOW ENDURANCE™ HFDB-0586 BK with each formulation.
General Information
Uses
  • Medium Voltage Semiconductive Shield
  • Semiconductive Shield
  • Underground cable
  • Cable guard
  • Wire and cable applications
Agency Ratings
  • AEIC CS8
  • AEIC CS9
  • BS 6622
  • EDF HN 33-S-23
  • EDF HN 33-S-52
  • HD 620 S1
  • ICEA S-66-524
  • ICEA S-94-649
  • IEC 60502
  • IEC 60840
  • NEMA WC-7
  • UL 1072
  • VDE 0263
  • VDE 0273
Forms
  • Particle
PhysicalNominal ValueUnitTest Method
Density 1.10g/cm³ASTM D1505
Environmental Stress-Cracking Resistance (100% Igepal, F0)> 504hrASTM D1693
MechanicalNominal ValueUnitTest Method
Tensile Strength 15.9MPaASTM D638
Tensile Elongation (Break)300%ASTM D638
AgingNominal ValueUnitTest Method
Tensile strength retention- 1 week (150°C)90%ASTM D638
Elongation retention rate- 1 week (150°C)95%ASTM D638
ThermalNominal ValueUnitTest Method
Brittleness Temperature -40.0°CASTM D746
ElectricalNominal ValueUnitTest Method
Volume Resistivity ASTM D991
    23°C 6.0ohms·cmASTM D991
    90°C 20ohms·cmASTM D991
    130°C 15ohms·cmASTM D991
Additional Information
Nominal property values above represent tests on molded stress-relieved slabs. Cure times were 15 minutes at 175°C.Storage The environment or conditions of storage greatly influences the recommended storage time. Storage should be in accordance with good manufacturing practices. If proper warehousing and storage temperatures [dry conditions, between 50°F and 86°F (10°C and 30°C) in temperature] are utilized, this product may be stored by the customer for up to one year. It is recommended that the practice of using the product on a first-in / first-out basis be established. Storage under extreme conditions may affect the quality, processing, or performance of the product.
ExtrusionNominal ValueUnit
Drying Temperature 60.0 - 70.0°C
Drying Time < 6.0hr
Melt Temperature 121 - 140°C
Extrusion instructions
DOW ENDURANCE™ HFDB-0586 BK provides excellent surface finish and outstanding output rates over a broad range of conditions. For optimum results, use melt extrusion temperatures in the suggested range of 250 to 285°F (121 to 140°C) to avoid pre-cure or scorch. Extruder barrel settings of 230°F (110°C) are suggested as a starting point while learning to process DOW ENDURANCE™ HFDB-0586 BK. Specific machine settings will depend on the extruder design and must be established through conventional practices. The curing temperature should be carefully controlled, and the maximum surface temperature in the CV tube should not exceed 572°F (300°C) for optimum results.Dehumidified air hopper drying at 140-160°F (60-70°C) for up to six hours may be employed to remove residual moisture prior to extrusion. Drying is not necessary for DOW ENDURANCE™ HFDB-0586 BK due to the lower moisture absorption characteristics relative to conventional semiconductive products.
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