| Category: | PC , Polycarbonate |
| Manufacturer: | Shanghai KumhoSunny Plastics Co., Ltd. |
| Trademark: | KumhoSunny PC |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 4b3GHB_KumhoSunny-PC-HCG2530HG.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
|---|
| HCG2530HG is 30%GF PC resin. It has high flow, high rigidity, high stability and high gloss. HCG2530HG is mainly used in mobile phone housing, electron & electric parts,etc. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| UL File Number |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.42 | g/cm³ | ASTM D792 |
| Melt Mass-Flow Rate (MFR) (300°C/1.2 kg) | 10 | g/10 min | ASTM D1238 |
| Molding Shrinkage - Flow | 0.20 to 0.40 | % | ASTM D955 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength | 120 | MPa | ASTM D638 |
| Tensile Elongation (Break) | 1.2 | % | ASTM D638 |
| Flexural Modulus | 8500 | MPa | ASTM D790 |
| Flexural Strength | 160 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (3.20 mm) | 110 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed) | 110 | °C | ASTM D648 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity | > 1.0E+15 | ohms | IEC 60093 |
| Volume Resistivity | > 1.0E+15 | ohms·cm | IEC 60093 |
| Flammability | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flame Rating (1.60 mm) | HB | UL 94 |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 90.0 to 110 | °C | |
| Drying Time | 3.0 to 4.0 | hr | |
| Suggested Max Moisture | 0.020 | % | |
| Rear Temperature | 250 to 270 | °C | |
| Middle Temperature | 260 to 280 | °C | |
| Front Temperature | 280 to 300 | °C | |
| Nozzle Temperature | 280 to 290 | °C | |
| Processing (Melt) Temp | 270 to 315 | °C | |
| Mold Temperature | 60.0 to 100 | °C | |
| Back Pressure | 0.300 to 1.00 | MPa | |
| Screw Speed | 20 to 100 | rpm |
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