Plaskon NXG-1HS Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is an epoxy molding compound for high temperature, lead-free reflow in heat spreader applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a "green" compound with no halogens and a lower Tg than multifunctional materials.

General Information
Features	Semi-conductive Low (to no) lead content Low hygroscopicity Fast curing Good formability Heat resistance, high Halogen-free
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	2.00	g/cm³	ASTM D792

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus			ASTM D790
22°C	2.45	MPa	ASTM D790
260°C	0.118	MPa	ASTM D790
Flexural Strength			ASTM D790
22°C	0.0123	MPa	ASTM D790
260°C	9.81E-4	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	160	°C	ASTM E1356
CLTE - Flow	8.5E-6	cm/cm/°C	ASTM D696
Thermal Conductivity	0.70	W/m/K	ASTM C177

Flammability	Nominal Value		Test Method
Flame Rating (3.18 mm)	V-0		UL 94

Additional Information
Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 6 monthsLife @ 22°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 0.5 daysSpiral Flow, 175°C, 1000 psi: 132 cmShimadzu Viscosity, 175°C, 1000 psi: 55 poiseRam Follower Gel Time, 175°C, 1000 psi: 18 secAsh Content: 88.6 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.28%Cull Hot Hardness, Shore D: 80All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 8.5 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 33 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 6 monthsLife @ 22°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 0.5 daysSpiral Flow, 175°C, 1000 psi: 132 cmShimadzu Viscosity, 175°C, 1000 psi: 55 poiseRam Follower Gel Time, 175°C, 1000 psi: 18 secAsh Content: 88.6 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.28%Cull Hot Hardness, Shore D: 80All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 8.5 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 33 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Molding Temperature: 165 to 185°C Molding Pressure: 1000 psi In Mold Cure Time: 50 to 100 sec Post Mold Cure Time, 175°C: 0 to 2 hr

Resin Grade	Manufacturer	Category	Trademark
Silmar® SIL93BE-1586	Interplastic Corporation	Polyester, TS	Silmar®
APEX® 87-L101C-1	Teknor Apex Company	PVC, Flexible	APEX®
Ecomass® 1002ZD96	Ecomass Technologies	Nylon Copolymer	Ecomass®
TECACOMP® PA66 GF30 TF15 HI black 3366	Ensinger GmbH	Nylon 66	TECACOMP®
TechnoElast S A6002 I 1 nat	TechnoCompound GmbH	TPE	TechnoElast

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	43A1Cy_Plaskon-NXG-1HS.pdf
PRICE:	Order Products email sales@su-jiao.com