EPO-TEK® 920

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 3kwlPt_EPO-TEK-920.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. It is a NASA approved, low outgassing epoxy.
General Information
Features
  • Electrically Insulating
  • Low to No Outgassing
  • Thermally Conductive
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • Optical Applications
  • Printed Circuit Boards
  • Seals
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
Processing Method
  • Potting
PhysicalNominal ValueUnit
Particle Size < 50.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 343°C
Die Shear Strength - >15 kg (23°C) 35.2MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 5.25GPa
Thixotropic Index 2.10
Weight Loss on Heating
    200°C < 0.050%
    250°C 0.24%
    300°C 0.77%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 90.0°C
CLTE - Flow
    -- 22.4E-5cm/cm/°C
    -- 31.2E-4cm/cm/°C
Thermal Conductivity 0.97W/m/K
ThermosetNominal ValueUnit
Thermoset Components
    Part A Mix Ratio by Weight: 100
    Part B Mix Ratio by Weight: 3.0
Shelf Life (23°C)26wk
Uncured PropertiesNominal ValueUnit
Color
    -- 4Amber
    -- 5Grey
Density
    Part B 1.02g/cm³
    Part A 2.23g/cm³
Viscosity 6(23°C)13 to 20Pa·s
Curing Time (150°C)1.0hr
Pot Life 300min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)90
Lap Shear Strength (23°C)> 13.8MPa
Relative Permittivity (1 kHz)5.19
Volume Resistivity (23°C)> 1.0E+14ohms·cm
Dissipation Factor (1 kHz)8.0E-3
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .20 rpm
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