EPO-TEK® H67MP-GB

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 3dOGMc_EPO-TEK-H67MP-GB.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD-883/Test Method 5011 for hybrid microelectronic packaging and assemblies. It maybe used for bonding SMDs, die-attach, substrate-attach or general heat sinking. It is a version of EPO-TEK® H67MP which contains 2 mil glass beads.
General Information
Features
  • Electrically Insulating
  • Thermally Conductive
Uses
  • Adhesives
  • Bonding
  • Electrical/Electronic Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
  • MIL Std. 883
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- < 200ppm
    K+ < 50ppm
    Na+ < 50ppm
    NH4+ 44ppm
Particle Size < 55.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 360°C
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 5.88GPa
Weight Loss on Heating
    200°C 0.29%
    250°C 0.79%
    300°C 1.6%
ThermalNominal ValueUnit
Glass Transition Temperature 93.0°C
CLTE - Flow
    -- 11.7E-5cm/cm/°C
    -- 27.5E-5cm/cm/°C
Thermal Conductivity 0.43W/m/K
ThermosetNominal ValueUnit
Shelf Life (-40°C)52wk
Uncured PropertiesNominal ValueUnit
Color White
Density 2.00g/cm³
Viscosity 3(23°C)330Pa·s
Curing Time (150°C)1.0hr
Pot Life 40000min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)86
Lap Shear Strength (23°C)> 13.8MPa
Relative Permittivity (1 kHz)5.01
Volume Resistivity (23°C)2.0E+13ohms·cm
Dissipation Factor (1 kHz)4.5E-3
Note Message
1 .Below Tg
2 .Above Tg
3 .1 rpm
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