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Epoxies, Ect. 50-1225

Category:	Silicone , Silicone
Manufacturer:	Epoxies, Etc.
Trademark:	Epoxies, Ect.
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	34a0gI_Epoxies-Ect-50-1225.pdf
PRICE:	Order Products email sales@su-jiao.com

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Message
50-1225 is a low viscosity, room temperature curing silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. 50-1225 can be used for potting or encapsulating electronic packages that have sensitive components. Due to its low stress during and after cure, this material will not crush or damage delicate components. This silicone system will maintain its low durometer through aging and thermal cycling. 50-1225 provides high heat transfer and does not require a post cure. It may be used immediately after curing at operating temperatures of -65°C to 210°C. Features: Flexible Thermally conductive Solvent free Deep section curing (beyond 1-2 inches) high operating temperatures Benefits: Low stress on components and vibration resistant Quick heat dissipation extends electronic life No by-products released during cure and safe to handle No need for multiple pours Good protection in extreme environmental applications

Message

50-1225 is a low viscosity, room temperature curing silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.

50-1225 can be used for potting or encapsulating electronic packages that have sensitive components. Due to its low stress during and after cure, this material will not crush or damage delicate components. This silicone system will maintain its low durometer through aging and thermal cycling.

50-1225 provides high heat transfer and does not require a post cure. It may be used immediately after curing at operating temperatures of -65°C to 210°C.

Features:

Flexible

Thermally conductive

Solvent free

Deep section curing (beyond 1-2 inches)

high operating temperatures

Benefits:

Low stress on components and vibration resistant

Quick heat dissipation extends electronic life

No by-products released during cure and safe to handle

No need for multiple pours

Good protection in extreme environmental applications

General Information
Features	Flame Retardant Good Corrosion Resistance Good Flexibility Good Weather Resistance Low Viscosity Soft Thermally Conductive
Appearance	White
Processing Method	Encapsulating Potting

Physical	Nominal Value	Unit
Molding Shrinkage - Flow ¹	< 0.20	%

Thermal	Nominal Value	Unit
Thermal Conductivity	1.7	W/m/K

Additional Information	Nominal Value	Unit
Thermal Shock	Pass

Uncured Properties	Nominal Value	Unit
Color	White
Mix Ratio by Weight (PBW)
Part A	100
Part B	10
Density (25°C)	2.00	g/cm³
Viscosity (25°C)	32	Pa·s
Pot Life ²(25°C)	30	min
Shelf Life	6	month

Cured Properties	Nominal Value	Unit
Shore Hardness (Shore A)	35
Tensile Strength	5.86	MPa
Tensile Elongation at Break	120	%
Electric Strength (1.59 mm)	24	kV/mm
Relative Permittivity
1 kHz, 25°C	2.50
100 Hz, 25°C	2.50
Volume Resistivity	1.0E+14	ohms·cm

Note Message
1 .	3 days at 25°C
2 .	100 grams

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