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EPO-TEK® 360T
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 2tB1UI_EPO-TEK-360T.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic paste for non-flow properties. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 341 | °C | |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 175 | °C | |
| Intermittent | -55 to 275 | °C | |
| Storage Modulus (23°C) | 2.19 | GPa | |
| Thixotropic Index | 5.10 | ||
| Weight Loss on Heating | |||
| 200°C | 0.59 | % | |
| 250°C | 1.8 | % | |
| 300°C | 4.3 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 80.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 5.3E-5 | cm/cm/°C | |
| -- 3 | 1.5E-4 | cm/cm/°C |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 10 | ||
| Shelf Life (23°C) | 26 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Tan | ||
| Density | |||
| Part B | 1.02 | g/cm³ | |
| Part A | 1.16 | g/cm³ | |
| Viscosity 6(23°C) | 4.0 to 6.0 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 240 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 75 | ||
| Lap Shear Strength (23°C) | 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 3.84 | ||
| Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.014 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 50 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Shuman PC 980 | Shuman Plastics, Inc. | PC | Shuman PC |
| SLOVAMID® 66 HI | Plastcom | Nylon 66 | SLOVAMID® 66 |
| WELLAMID Nylon 6600 MR 209 HWCP | CP-Polymer-Technik GmbH & Co. KG | Nylon 66 | WELLAMID Nylon |
| INLUBE PPSLTF10 | Infinity LTL Engineered Compounds | PPS | INLUBE |
| MAJORIS ET265 - 1770 | AD majoris | PP, Unspecified | MAJORIS |
