| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 2P2fpI_EPO-TEK-B9021-13.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
|---|
| A single component, thermally conductive, electrically insulating, B-stageable epoxy paste. It was designed for heat sinking applications found at the semiconductor and PCB level electronics packaging. It may also be used for B-stage assembly of 1) window-sealing optical devices and sensors; 2) substrate attach and 3) lid-sealing hybrids. |
| General Information | |
|---|---|
| Features |
|
| Uses |
|
| Agency Ratings |
|
| RoHS Compliance |
|
| Forms |
|
| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 345 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 175 | °C | |
| Intermittent | -55 to 275 | °C | |
| Storage Modulus (23°C) | 2.57 | GPa | |
| Thixotropic Index | 3.44 | ||
| Weight Loss on Heating | |||
| 200°C | 2.5 | % | |
| 250°C | 4.0 | % | |
| 300°C | 6.8 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature | 70.0 | °C | |
| CLTE - Flow | |||
| -- 1 | 4.0E-5 | cm/cm/°C | |
| -- 2 | 1.4E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.96 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life 3 | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | White | ||
| Density | 1.31 | g/cm³ | |
| Viscosity 4(23°C) | 15 to 25 | Pa·s | |
| Curing Time | |||
| 80°C 5 | 0.50 | hr | |
| 150°C | 0.50 | hr | |
| Pot Life | 1400 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 80 | ||
| Lap Shear Strength (23°C) | 5.34 | MPa |
| Note Message | |
|---|---|
| 1 . | Below Tg |
| 2 . | Above Tg |
| 3 . | Refrigerated |
| 4 . | 10 rpm |
| 5 . | B-stage |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| GPPC PS-350 | GPPC Chemical Co., Ltd. | PS (HIPS) | GPPC |
| HiFill® PA6/6 GF25 HS L | Techmer Engineered Solutions | Nylon 66 | HiFill® |
| Hostaform® S 9364LPB | Celanese Corporation | Acetal (POM) Copolymer | Hostaform® |
| PermaStat® 602 | RTP Company | ABS | PermaStat® |
| OTECH PVC OW132 - Wire Jacket | OTECH Corporation | PVC, Unspecified | OTECH PVC |