Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | 2P2fpI_EPO-TEK-B9021-13.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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A single component, thermally conductive, electrically insulating, B-stageable epoxy paste. It was designed for heat sinking applications found at the semiconductor and PCB level electronics packaging. It may also be used for B-stage assembly of 1) window-sealing optical devices and sensors; 2) substrate attach and 3) lid-sealing hybrids. |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Particle Size | < 20.0 | µm |
Additional Information | Nominal Value | Unit | |
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Degradation Temperature | 345 | °C | |
Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
Operating Temperature | |||
Continuous | -55 to 175 | °C | |
Intermittent | -55 to 275 | °C | |
Storage Modulus (23°C) | 2.57 | GPa | |
Thixotropic Index | 3.44 | ||
Weight Loss on Heating | |||
200°C | 2.5 | % | |
250°C | 4.0 | % | |
300°C | 6.8 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature | 70.0 | °C | |
CLTE - Flow | |||
-- 1 | 4.0E-5 | cm/cm/°C | |
-- 2 | 1.4E-4 | cm/cm/°C | |
Thermal Conductivity | 0.96 | W/m/K |
Thermoset | Nominal Value | Unit | |
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Shelf Life 3 | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
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Color | White | ||
Density | 1.31 | g/cm³ | |
Viscosity 4(23°C) | 15 to 25 | Pa·s | |
Curing Time | |||
80°C 5 | 0.50 | hr | |
150°C | 0.50 | hr | |
Pot Life | 1400 | min |
Cured Properties | Nominal Value | Unit | |
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Shore Hardness (Shore D) | 80 | ||
Lap Shear Strength (23°C) | 5.34 | MPa |
Note Message | |
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1 . | Below Tg |
2 . | Above Tg |
3 . | Refrigerated |
4 . | 10 rpm |
5 . | B-stage |
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