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Ablebond 965-1L
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Henkel Ablestik |
| Trademark: | Ablebond |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 1sm7TY_Ablebond-965-1L.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| ABLEBOND® 965-1L electrically conductive, stress-absorbing die attach adhesive is designed for bonding large die integrated circuits to substrates with mismatched coefficients of thermal expansion. ABLEBOND 965-1L adhesive exhibits very low levels of contaminants. The rheology of this adhesive is tailored for high speed,automated assembly operations. This product cures to yield a void-free bondline with minimal resin bleed. |
| General Information | |
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| Features |
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| Uses |
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| Forms |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| pH | 5.5 | Internal Method | |
| Weight - Loss on Cure | 4.2 | % | Internal Method |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Ionic Chloride | < 15 | ppm | Internal Method |
| Ionic Potassium | < 5 | ppm | Internal Method |
| Ionic Sodium | < 10 | ppm | Internal Method |
| Thixotropic Index 1 | 4.50 | Internal Method | |
| Water Extract Conductivity | 7.00 | µS/cm | Internal Method |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus | |||
| -65°C, 0.500 mm | 5800 | MPa | Internal Method |
| 25°C, 0.500 mm | 4800 | MPa | Internal Method |
| 150°C, 0.500 mm | 290 | MPa | Internal Method |
| 250°C, 0.500 mm | 300 | MPa | ISO 527-2 |
| Shear Strength 2 | Internal Method | ||
| 25°C | 0.981 | MPa | |
| 250°C | 0.0588 | MPa |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Glass Transition Temperature | 72.0 | °C | Internal Method |
| CLTE - Flow | Internal Method | ||
| < 72°C | 5.0E-5 | cm/cm/°C | |
| > 72°C | 1.9E-4 | cm/cm/°C | |
| Thermal Conductivity | 3.0 | W/m/K | Internal Method |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Volume Resistivity | 5.0E-4 | ohms·cm | IEC 60093 |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Pot Life (25°C) | 1400 | min | |
| Shelf Life (-40°C) | 52 | wk | |
| Thermoset Mix Viscosity 3(25°C) | 12000 | cP | Internal Method |
| Demold Time (175°C) | 60 | min |
| Note Message | |
|---|---|
| 1 . | Viscosity @ 0.5/Viscosity @ 5 rpm |
| 2 . | 2 x 2mm (80 x 80 mil) Si die,10 0.6 on Ag/Cu leadframe |
| 3 . | Brookfield CP51 @ 5 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Sarlink® TPV X6170N | Teknor Apex Company | TPV | Sarlink® TPV |
| Rotec® PC 7015 | ROMIRA GmbH | PC | Rotec® PC |
| Vexel PBT B12U | Custom Resins Group | PBT | Vexel |
| AKROLOY® PA ICF 20 black (5268) | AKRO-PLASTIC GmbH | Nylon 66+Nylon 6I/6T | AKROLOY® |
| DAPCO™ 3012 | Cytec Industries Inc. | Epoxy | DAPCO™ |
