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EPO-TEK® TV1002
| Category: | PI, TS , Thermoset Polyimide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 1hFMdt_EPO-TEK-TV1002.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400°C seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine print definition, high Tg, low outgassing, and ionic cleanliness are a few of its traits. Formerly 201-180-4 |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 50 | ppm | |
| K+ | 2 | ppm | |
| Na+ | 107 | ppm | |
| NH4+ | 27 | ppm | |
| Particle Size | < 10.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 519 | °C | |
| Drying Time | 672.0 | hr | |
| Operating Temperature | |||
| Continuous | -55 to 300 | °C | |
| Intermittent | -55 to 400 | °C | |
| Storage Modulus (23°C) | 7.79 | GPa | |
| Thixotropic Index | > 1.30 | ||
| Weight Loss on Heating | |||
| 200°C | 0.22 | % | |
| 250°C | 0.23 | % | |
| 300°C | 0.29 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 200 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.6E-5 | cm/cm/°C | |
| -- 3 | 1.4E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.76 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Black | ||
| Density | 1.22 | g/cm³ | |
| Viscosity 4(23°C) | 350 to 550 | Pa·s | |
| Curing Time 5 | 2.0 | hr |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 80 |
| Note Message | |
|---|---|
| 1 . | Cure 150°C/1 hour + 275°C/1 hours; Ramp 20°C/min to 350°C |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 0.5 rpm |
| 5 . | 150°C/1 Hour + 275°C/1 Hour |
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