Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | 0qB4SU_EPO-TEK-920-FL.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
---|
EPO-TEK® 920-FL is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920. |
General Information | |
---|---|
Features |
|
Uses |
|
Agency Ratings |
|
RoHS Compliance |
|
Forms |
|
Processing Method |
|
Physical | Nominal Value | Unit | |
---|---|---|---|
Particle Size | < 50.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
---|---|---|---|
Degradation Temperature | 362 | °C | TGA |
Die Shear Strength - >20 kg (23°C) | 46.9 | MPa | |
Operating Temperature | |||
Continuous | -55 to 200 | °C | |
Intermittent | -55 to 300 | °C | |
Storage Modulus (23°C) | 5.40 | GPa | |
Thixotropic Index | 3.10 | ||
Weight Loss on Heating | |||
200°C | 0.20 | % | |
250°C | 0.28 | % | |
300°C | 0.48 | % |
Thermal | Nominal Value | Unit | |
---|---|---|---|
Glass Transition Temperature 1 | > 90.0 | °C | |
CLTE - Flow | |||
-- 2 | 2.1E-5 | cm/cm/°C | |
-- 3 | 9.7E-5 | cm/cm/°C | |
Thermal Conductivity | 0.89 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
---|---|---|---|
Thermoset Components | |||
Part A | Mix Ratio by Weight: 100 | ||
Part B | Mix Ratio by Weight: 3.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
---|---|---|---|
Color | |||
-- 4 | Amber | ||
-- 5 | Grey | ||
Density | |||
Part B | 1.02 | g/cm³ | |
Part A | 2.51 | g/cm³ | |
Viscosity 6(23°C) | 8.0 to 12 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 420 | min |
Cured Properties | Nominal Value | Unit | Test Method |
---|---|---|---|
Shore Hardness (Shore D) | 93 | ||
Lap Shear Strength (23°C) | > 13.8 | MPa | |
Relative Permittivity (1 kHz) | 5.96 | ||
Volume Resistivity (23°C) | > 4.0E+13 | ohms·cm | |
Dissipation Factor (1 kHz) | 9.0E-3 |
Note Message | |
---|---|
1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -40-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part B |
5 . | Part A |
6 . | 20 rpm |
Resin Grade | Manufacturer | Category | Trademark |
---|---|---|---|
Rynite® RE5329 BK503 | DuPont Performance Polymers | PET | Rynite® |
SLOVAMID® 66 GF 15 T 25 | Plastcom | Nylon 66 | SLOVAMID® 66 |
SureSpec PET-76 | Genesis Polymers | PET | SureSpec |
apilon 52c® C 64 PC | API SpA | TPU-PC | apilon 52c® |
Hifax TRC 770P G01 BLK | LyondellBasell Industries | TPO (POE) | Hifax |