EPO-TEK® GE116

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 0P1rTP_EPO-TEK-GE116.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, medical, automotive, and scientific/OEM. It is a red color version of EPO-TEK® 115-SMT.
General Information
Features
  • Electrically Insulating
  • Thermally Insulating
  • Thixotropic
Uses
  • Adhesives
  • Automotive Applications
  • Bonding
  • Electrical/Electronic Applications
  • Medical/Healthcare Applications
  • Printed Circuit Boards
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Particle Size < 20.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 344°C
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 175°C
    Intermittent -55 to 275°C
Storage Modulus (23°C) 3.02GPa
Weight Loss on Heating
    200°C 0.27%
    250°C 1.1%
    300°C 3.0%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 65.0°C
CLTE - Flow
    -- 24.1E-5cm/cm/°C
    -- 32.2E-4cm/cm/°C
ThermosetNominal ValueUnit
Shelf Life (-40°C)52wk
Uncured PropertiesNominal ValueUnit
Color Red
Density 1.15g/cm³
Viscosity 4(23°C)200 to 300Pa·s
Curing Time (150°C)1.0hr
Pot Life 40000min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)80
Lap Shear Strength (23°C)10.8MPa
Relative Permittivity (1 kHz)3.48
Volume Resistivity (23°C)> 7.0E+13ohms·cm
Dissipation Factor (1 kHz)7.0E-3
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .1 rpm
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