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Lucon® CP6050
| Category: | PC+ABS , Polycarbonate + ABS |
| Manufacturer: | LG Chem Ltd. |
| Trademark: | Lucon® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 0MOsh0_LuconCP6050.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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Description Electrostatic Dissipation (1.0E+04 ~ 1.0E+06 ohm) Low Liquid Particle Counts Application HDD parts |
| General Information | |
|---|---|
| Filler / Reinforcement |
|
| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.17 - 1.18 | g/cm³ | ASTM D792 |
| Melt Mass-Flow Rate (MFR) (300°C/2.16 kg) | 4.0 | g/10 min | ASTM D1238 |
| Molding Shrinkage - Flow (3.20 mm) | 0.40 - 0.70 | % | ASTM D955 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength 1(Yield, 3.20 mm) | 58.8 | MPa | ASTM D638 |
| Tensile Elongation 2(Break, 3.20 mm) | 5.0 | % | ASTM D638 |
| Flexural Modulus 3(3.20 mm) | 2350 | MPa | ASTM D790 |
| Flexural Strength 4(3.20 mm) | 93.2 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C, 3.20 mm) | 98 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed, 6.40 mm) | 125 | °C | ASTM D648 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity | 1.0E+4 - 1.0E+8 | ohms | IEC 60093 |
| Volume Resistivity (23°C) | 1.0E+4 - 1.0E+8 | ohms·cm | ASTM D257 |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Electrostatic Decay 5 | sec |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 80 - 100 | °C | |
| Drying Time | 3.0 - 5.0 | hr | |
| Suggested Max Moisture | 0.020 | % | |
| Rear Temperature | 240 - 270 | °C | |
| Middle Temperature | 245 - 275 | °C | |
| Front Temperature | 250 - 280 | °C | |
| Nozzle Temperature | 250 - 280 | °C | |
| Processing (Melt) Temp | 250 - 280 | °C | |
| Mold Temperature | 50 - 80 | °C | |
| Back Pressure | 0.981 - 3.92 | MPa | |
| Screw Speed | 40 - 70 | rpm |
| Note Message | |
|---|---|
| 1 . | 50 mm/min |
| 2 . | 50 mm/min |
| 3 . | 10 mm/min |
| 4 . | 10 mm/min |
| 5 . | 1000V to <100V |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| SUMILITE® PL-1125 | Sumitomo Bakelite Co., Ltd. | Phenolic | SUMILITE® |
| TOTAL Polystyrene Compound 818R | TOTAL Refining & Chemicals | PS (Specialty) | TOTAL Polystyrene |
| HiFill® PA6 GF35 HS L | Techmer Engineered Solutions | Nylon 6 | HiFill® |
| EPIMAX® PC-900FVR | Osterman & Company | PC | EPIMAX® |
| Infino HM-1152 | LOTTE ADVANCED MATERIALS CO., LTD. | PC+ABS | Infino |
