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EPO-TEK® H24
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 0LHI8h_EPO-TEK-H24.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK ® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 60 | ppm | |
| K+ | 8 | ppm | |
| Na+ | 88 | ppm | |
| NH4+ | 21 | ppm | |
| Particle Size | < 45.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 470 | °C | TGA |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 3.34 | GPa | |
| Thixotropic Index | 1.86 | ||
| Weight Loss on Heating | |||
| 200°C | 0.040 | % | |
| 250°C | 0.040 | % | |
| 300°C | 0.10 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 100 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.8E-5 | cm/cm/°C | |
| -- 3 | 1.0E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.67 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 5.0 | ||
| Shelf Life (23°C) | 26 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Silver | ||
| Density | |||
| Part B | 1.05 | g/cm³ | |
| Part A | 2.09 | g/cm³ | |
| Viscosity 6(23°C) | 15 to 23 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 1100 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 76 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Volume Resistivity (23°C) | < 0.020 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 10 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| SCHULADUR® HT GF 30 | A. Schulman Europe | PCT | SCHULADUR® |
| Tekumid 6 BS | TEKUMA Kunststoff GmbH | Nylon 6 | Tekumid |
| Sumiflex® QE QE128ATH | Mitsubishi Chemical Corporation | TES | Sumiflex® QE |
| DESOX™ DSC411GM4 | DESCO Co., Ltd. | PBT | DESOX™ |
| Karina BLACK PVC COMPOUND 510-DA-48/1-Y-IS-BZ (***) | Karina Ind. e Com. de Plásticos Ltda | PVC, Unspecified | Karina |
